Supply, Delivery, Installation, Commissioning, Calibration and Validation of an Electroplating and Wet Processing System, for Tyndall National Institute, University College Cork (UCC)
The contract covers the supply, delivery, installation, commissioning, calibration and validation of an electroplating and wet processing system for Tyndall National Institute at University College Cork (UCC), a higher-education and research organisation in Ireland. The system will support photonic packaging and interconnect technology development, including advanced interposers, 3D interconnects and redistribution lines. It must provide void-free plating and filling of through-glass vias and through-silicon vias on wafers up to 300 mm using gold and copper-based chemistries, while producing highly repeatable, flat electroplated structures on III-V materials. The estimated contract value is £1,250,000, with the opportunity concerning delivery and implementation at the Tyndall National Institute in the IE053 region; no contract duration is stated. The critical technical requirement is that the proposed system can achieve void-free TGV and TSV plating and filling at wafer sizes up to 300 mm in both specified chemistry types.
Buyer: University College Cork. Source: eTenders Ireland. Updated 15 Oct 2026.
Key facts
- Estimated value: €1.3m
- Bids close: 13 Nov 2026
- Location: South-West
- Procedure: Open
- Category: Laboratory, optical and precision equipments (excl. glasses) (38000000)
From the official notice
Tenders are sought for the Supply, Delivery, Installation, Commissioning, Calibration and Validation of an Electroplating and wet processing system, for Tyndall National Institute, University College Cork (UCC): The new electroplating tool will enhance the capabilities at the Tyndall National Institute for the development of photonic packaging solutions and interconnect technology through advanced interposers, 3D interconnects, and redistribution lines. We invite proposals for a tool that is capable providing the required technology to enable the development of these technologies. The system should be capable of void free plating and filling of both through glass via (TGV) and through silicon vias (TSV) structures on wafer sizes up to 300 mm in both gold and copper-based chemistries. It should also be capable of providing highly repeatable and flat electroplated structures on III V materials. Tenderers with cutting-edge solutions that can achieve these high standards are encouraged to submit their proposals for this vital component in our technological advancement.
View the official notice
Questions about this tender
When is the deadline?
Bids close on 13 Nov 2026.
What is it worth?
The estimated value is €1.3m.
Who can apply?
Any supplier that meets the buyer's requirements can apply. Check the official notice for conditions.
How do I bid?
Open the official notice, register on the buyer's portal and submit your bid before the deadline.
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